发明名称 |
Method and apparatus for polishing a substrate |
摘要 |
The present invention is to provide a method and device for polishing a glass substrate, suitable for polishing a large-sized glass substrate. The device for polishing a substrate is adapted so that a substrate is attached to a film stretched on a frame; the frame is installed on a carrier; the carrier and a polishing surface-plate are brought closer relative to each other to polish a surface to be polished of the substrate attached to the film by pressing the substrate to the polishing surface-plate; the frame is removed from the carrier after the completion of the polishing, and the polished substrate is removed from the frame. |
申请公布号 |
US2005130386(A1) |
申请公布日期 |
2005.06.16 |
申请号 |
US20050045089 |
申请日期 |
2005.01.31 |
申请人 |
ASAHI GLASS COMPANY LIMITED |
发明人 |
WATANABE ITSURO;KUBO TAKASHI |
分类号 |
G02F1/1333;B24B37/04;(IPC1-7):B24B7/00;B24B9/00;H01L21/76 |
主分类号 |
G02F1/1333 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|