发明名称 Method and apparatus for polishing a substrate
摘要 The present invention is to provide a method and device for polishing a glass substrate, suitable for polishing a large-sized glass substrate. The device for polishing a substrate is adapted so that a substrate is attached to a film stretched on a frame; the frame is installed on a carrier; the carrier and a polishing surface-plate are brought closer relative to each other to polish a surface to be polished of the substrate attached to the film by pressing the substrate to the polishing surface-plate; the frame is removed from the carrier after the completion of the polishing, and the polished substrate is removed from the frame.
申请公布号 US2005130386(A1) 申请公布日期 2005.06.16
申请号 US20050045089 申请日期 2005.01.31
申请人 ASAHI GLASS COMPANY LIMITED 发明人 WATANABE ITSURO;KUBO TAKASHI
分类号 G02F1/1333;B24B37/04;(IPC1-7):B24B7/00;B24B9/00;H01L21/76 主分类号 G02F1/1333
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