摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing circuit boards and an assembly board for manufacturing the circuit boards whereby the uselessness of the assembly board is so reduced as to make possible an improvement of the productivity of the circuit boards and the reduction of the manufacturing cost of them. SOLUTION: The method for manufacturing circuit boards A has a process for mounting a plurality of electronic components 2 and a plurality of auxiliary components 3 on an assembly board 1, wherein there are arranged the plurality of columns of circuit-formation predetermining regions 10 for forming a plurality of circuits; and has a process for manufacturing by dividing the assembly board 1 into a plurality of boards 10a, the plurality of circuit boards A in each of which a portion of each auxiliary component 3 is so provided as to be protruded from each board 10a. Further, this method for manufacturing the circuit boards A has a process for so dividing, before the process for mounting the plurality of auxiliary components 3, the assembly board 1 into the plurality of columns of the circuit-formation predetermining regions 10A-10D as to separate from each other the adjacent columns of the regions 10A-10D to each other. COPYRIGHT: (C)2005,JPO&NCIPI
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