| 摘要 |
The invention(s) relates to a wafer test system including means capable of communicating an overdrive to a chuck, the chuck moving a wafer towards a probe head responsive to the overdrive, measuring a contact resistance of at least one channel in each of a plurality of dies associated with the wafer using the probe head, computing a per channel standard deviation responsive to measuring the contact resistance, comparing the standard deviation on the at least one channel to a threshold, and increasing the overdrive responsive to the comparison.
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