| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor laser unit which has a simple structure which is easy to be assembled and in which a heat dissipation is easy and raising of a function and reducing of a size reduction can be made compatible. <P>SOLUTION: The semiconductor laser unit includes a metal plate 100 which substantially coincides with either larger one of the width of a silicon substrate 120 and the width of a flexible sheet 130, a semiconductor laser 110, the silicon substrate 120 on which a photodetector and a signal processor are integrated, the flexible sheet 130, wiring 140, and an optical element 150. The flexible sheet 130 is divided into two on the metal plate 100, and the flexible sheet 130 divided into two is disposed oppositely so that the silicon substrate 120 is held. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
