发明名称 RESIN COMPOSITION FOR COVER TAPE, COVER TAPE USING RESIN COMPOSITION, AND PACKAGE
摘要 PROBLEM TO BE SOLVED: To provide a resin composition for a cover tape, which has a superior antistatic function, transparency, blocking resistance, and adhesiveness. SOLUTION: The resin composition for the cover tape is made by dissolving at least acrylic copolymers, which have a glass transition temperature of 40 to 70°C and are soluble in an organic solvent, conjugate conductive polymers, and polyanion in an organic solvent compatibly. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005126081(A) 申请公布日期 2005.05.19
申请号 JP20030360685 申请日期 2003.10.21
申请人 SHIN ETSU POLYMER CO LTD 发明人 TANIGUCHI ATSUSHI;KAWAGUCHI TOSHIYUKI
分类号 B65D73/02;B32B27/30;B65D85/86;C08J5/18;C08L33/04;(IPC1-7):B65D73/02 主分类号 B65D73/02
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