SUBSTRATE FOR ELECTRO-OPTICAL DEVICE AND ITS MOUNTING METHOD, ELECTRO-OPTICAL DEVICE AND ELECTRONIC DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a mounting substrate wherein an element chip can be surely joined with the mounting substrate.

SOLUTION: A wiring substrate (10) is provided with a storage wall (60) to store a paste adhesive agent (50) for joining an element chip (30) with the mounting substrate (10). The storage wall (60) for storing the paste adhesive agent (50) is formed on the wiring substrate (10). As a result, the paste adhesive agent (50) can be stored within an area surrounded by the storage wall (60), and defective contact (joint failure) between the element chip (30) and the mounting substrate (10) due to the flow of the paste adhesive agent (50) can be eliminated.

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