Method of making a lead-free integrated circuit package

摘要

An integrated circuit package ( 60 ) has a substrate ( 12 ) with a first surface ( 51 ) for mounting a semiconductor die ( 20 ) and a second surface ( 52 ) defining a via ( 70 ). A lead ( 26 ) is formed by plating a conductive material to project outwardly from the second surface. The conductive material extends from the lead through the first via for coupling to the semiconductor die.