| 摘要 |
PROBLEM TO BE SOLVED: To provide a wafer collective transfer method capable of collectively transferring wafers from a wafer cassette to a vertical wafer board having three legs surely at high operability without contaminating the wafers. SOLUTION: In the wafer collective transfer method, the wafer cassette 2 in which many wafers W are stored and a heat processing board 3 are arranged in a straight line so that mutual wafer insertion sides are opposed to each other, a carrier arm on which many arms 4a are formed is arranged in a straight line on the wafer anti-insertion side of the wafer cassette 2, a U shape type carrier arm 6 on which many U-shaped arm grooves 6a are formed is arranged in a straight line on the wafer anti-insertion side of the board 3, the carrier arm 4 is horizontally moved, the U shape type carrier arm 6 is horizontally moved so as to hold a leg erected on the wafer anti-insertion side of the heat processing board 3 with an interval, and a plurality of wafers stored in the wafer cassette 2 are collectively supported by the arm grooves 4a and the U-shaped arm grooves 6a, horizontally moved to the board side while being supported and collectively transferred to the board 3. COPYRIGHT: (C)2005,JPO&NCIPI |
