发明名称 POSITIVE PHOTORESIST COMPOSITION FOR ELECTRON BEAM, X-RAY OR EUV RAY, AND PATTERN FORMING METHOD USING SAME
摘要 <P>PROBLEM TO BE SOLVED: To provide a positive photoresist composition for an electron beam, X-ray or EUV ray which enhances sensitivity and resolution and improves the shape of a line edge part (line edge roughness). <P>SOLUTION: The positive photoresist composition for an electron beam, X-ray or EUV ray contains: a resin which has an acid decomposable group with a specified structure, is decomposed by the action of an acid and of which solubility into an alkali developer is increased thereby; and a compound which generates an acid by irradiation of an electron beam, X-ray or EUV ray. The pattern forming method uses the positive photoresist composition. <P>COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005099557(A) 申请公布日期 2005.04.14
申请号 JP20030334831 申请日期 2003.09.26
申请人 FUJI PHOTO FILM CO LTD 发明人 MIZUTANI KAZUYOSHI;YASUNAMI SHOICHIRO;ADEGAWA YUTAKA
分类号 G03F7/039;H01L21/027 主分类号 G03F7/039
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