发明名称 DIAMOND COMPOSITE SUBSTRATE
摘要 <p>It is an object of the present invention to provide a diamond substrate with high toughness, a large surface area, and high quality, for use in semiconductor materials, electronic components, optical components, and so forth, and a method for manufacturing this substrate. &lt;??&gt;A diamond polycrystalline film is laminated on the surface of a diamond monocrystalline substrate to create a diamond composite substrate. In said diamond composite substrate, it is preferable that the main face, which has the largest surface area of the diamond monocrystalline substrate, be the ä100ü plane, and the diamond polycrystalline film be laminated on the opposite face parallel to this face. The diamond monocrystalline substrate 3 may be made up of a plurality of diamond monocrystals having the same orientation of the main face, and these plurality of diamond monocrystals may be joined by a diamond crystal layer 4 to create a diamond composite substrate 2. The diamond monocrystals may also be used as seed crystals and diamond monocrystals provided by vapor phase synthesis on the surface thereof. &lt;IMAGE&gt;</p>
申请公布号 EP1522611(A1) 申请公布日期 2005.04.13
申请号 EP20040704342 申请日期 2004.01.22
申请人 SUMITOMO ELECTRIC INDUSTRIES, LTD. 发明人 MEGURO, KIICHI,;YAMAMOTO, YOSHIYUKI;IMAI, TAKAHIRO,
分类号 C30B33/06;C23C16/27;C30B29/04;C30B33/00;(IPC1-7):C30B29/04 主分类号 C30B33/06
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