发明名称 FINE PATTERN FORMING METHOD AND DEVICE
摘要 PROBLEM TO BE SOLVED: To precisely form a conductor circuit pattern having fine line width and low electrical resistance. SOLUTION: This fine pattern forming method is provided to arrange a liquid material discharging mechanism 1 opposite to a substrate 2, and to relatively change the positional relation between the discharging mechanism and the substrate, and to apply the liquid materials discharged by the discharging mechanism to the surface of the substrate with a fine pattern to form a conductive film, and to have the flying liquid materials discharged by the discharging mechanism irradiated with laser beams to heat the liquid materials. This fine pattern forming device is provided with a discharging means 1 which discharges the liquid materials to the substrate 2, a varying means which relatively changes the positional relation between the discharging means 1 and the substrate 2, and a laser-condensing means 5 which condenses a laser beam 15 on flying liquid discharged from the discharging means or the neighborhood of the surface of the liquid materials applied to the substrate. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005093889(A) 申请公布日期 2005.04.07
申请号 JP20030327969 申请日期 2003.09.19
申请人 YASKAWA ELECTRIC CORP 发明人 MATSUZAKI KAZUNARI
分类号 G02F1/1343;H01L21/288;(IPC1-7):H01L21/288;G02F1/134 主分类号 G02F1/1343
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