| 摘要 |
<P>PROBLEM TO BE SOLVED: To solve a following problem that a connection part between a semiconductor device and a copper pattern on a base material is easily broken due to temperature change since the semiconductor device and a substrate are different in thermal expansion coefficient in a semiconductor package. <P>SOLUTION: A flexible substrate is adhered on a mold, which is a base material formed of a resin, by means of an adhesive or an adhesive sheet. A semiconductor is subjected to flip chip packaging on the flexible substrate and stress due to heat shrinkage is relaxed by the flexible sheet and the adhesive or the adhesive sheet. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
