| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an optical transmission module for high-speed communication capable of reducing the number of components, facilitating manufacture and assembly and reducing the influence of parasitic inductance at a low cost. <P>SOLUTION: When the base of a light emitting element chip 1 is mounted on a heat sink 3A and a plurality of connection terminals 5 and 6 for respectively connecting the electrode and base of the light emitting element chip 1 electrically with the outside are provided, at least one through-hole 30 is formed at a part near the light emitting element chip of the heat sink and the connection terminal 5 whose connection object is the electrode of the light emitting element chip is inserted to the through-hole. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
