| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a substrate for sealing an electronic component that is excellent in productivity and electromagnetic noise eliminating characteristics at the time of manufacturing an electronic device by hermetically sealing a minute electronic machine mechanism on the principal surface of a semiconductor substrate, and to provide a method of manufacturing the electronic device. <P>SOLUTION: The substrate for sealing the electronic component comprises an insulating substrate 1 in which wiring conductors 2 are formed in a state that the conductors 2 are led out from one principal surface to the other principal surface or a side face, connection pads 3 which are formed on one principal surface of the substrate 1 and connected to the conductors 2, and a frame member 4 which is jointed to one principal surface of the substrate 1 to surround the connection pads 3. The substrate for sealing the electronic component also comprises connection terminals 5 which are formed on the pads 3 and have the same heights as that of the frame member 4. The minute electronic machine mechanism 8 of the electronic component 10 constituted by forming the mechanism 8 and electrodes 9 connected to the mechanism 8 on the principal surface of a semiconductor substrate 7 is hermetically sealed inside the frame member 4 by joining the electrodes 9 to the connection terminals 5 and the principal surface of the semiconductor substrate 7 to the principal surface of the frame member 4. At the same time, at least part of the wiring conductors 2 contains ferrite. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
