| 摘要 |
PROBLEM TO BE SOLVED: To provide a lift-off apparatus wherewith yield reduction or facility troubles due to pollution of wafers and facilities is suppressed in an IPA high-pressure jet-spray treatment. SOLUTION: A cover 5 is provided near the rear side of a wafer 1 in a lift-off treatment cup 4, and the gap between the cover 5 and the rear side of the wafer 1 is filled with IPA 105. Pollution by metal fragments 103a or resist fragments 102a is effectively reduced by using this design, and this increases the yield and decreases facility troubles. COPYRIGHT: (C)2005,JPO&NCIPI
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