发明名称 Method to form a structure to decrease area capacitance within a buried insulator device
摘要 Method to form a structure to decrease area capacitance within a buried insulator device structure is disclosed. A portion of the substrate layer of a buried insulator structure opposite the insulator layer from the gate is doped with the same doping polarity as the source and drain regions of the device, to provide reduced area capacitance. Such doping may be limited to portions of the substrate which are not below the gate.
申请公布号 US6867104(B2) 申请公布日期 2005.03.15
申请号 US20020334181 申请日期 2002.12.28
申请人 INTEL CORPORATION 发明人 STETTLER MARK A.;OBRADOVIC BORNA;GILES MARTIN D.;RIOS RAFAEL
分类号 H01L21/336;H01L27/01;H01L27/12;H01L29/786;H01L31/0392;(IPC1-7):H01L21/336 主分类号 H01L21/336
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