| 摘要 |
By mounting electronic circuit components using a microstrip line, transmission loss and variation in performance are reduced. At least one projection of substantially uniform height is provided on each of four side surfaces of the components. The components are disposed on the chassis by bringing their projections into contact with adjacent circuit components. A heat-resistant film or a heat-resistant tape is adhered to one or both side surfaces of adjacent side surfaces of the components, to dispose the components in contact with each other. A component-mounting nozzle is used to adsorb the components, and position them on the chassis in contact with a guide fitted on the chassis or in the vicinity of the chassis. It is also possible to position the components with actuators located around the chassis, after the components are provisionally disposed on the chassis with the component-mounting nozzle. |
