发明名称 |
DEVICE PACKAGE AND METHODS FOR THE FABRICATION AND TESTING THEREOF |
摘要 |
Provided are optoelectronic device packages. The packages include a bas e substrate having an optoelectronic device mounting region on a surface of th e base substrate and a lid mounting region. An optoelectronic device is mounted on the optoelectronic device mounting region. A lid is mounted an the lid mounting region to form an enclosed volume between the base substrate and the lid. The optoelectronic device is in the enclosed volume. The lid has an optically transmissive region suitable for transmitting light of a given wavelength along an optical path to or from the optoelectronic device, wherein at least a portio n of the lid mounting region is disposed along the optical path below the surface of the base substrate to a depth below the optical path. Also provided are wafer or grid level optoelectronic device packages, wafer- or grid-level optoelectronic device package lid and their methods of formation, and connectorized optoelectronic devices . |
申请公布号 |
CA2481637(A1) |
申请公布日期 |
2005.03.15 |
申请号 |
CA20042481637 |
申请日期 |
2004.09.15 |
申请人 |
ROHM AND HAAS ELECTRONIC MATERIALS, L.L.C. |
发明人 |
RASNAKE, LARRY J.;FISHER, JOHN J.;SHERRER, DAVID W. |
分类号 |
H01L23/02;G01R31/26;G02B6/36;G02B6/42;H01L21/28;H01L21/66;H01L23/48;H01L29/22;H01L33/00;H01S5/00;H01S5/022;H01S5/024 |
主分类号 |
H01L23/02 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|