INSOLUBLE ANODE LOOP IN COPPER ELECTRODEPOSITION CELL FOR INTERCONNECT FORMATION

摘要

Embodiments of the invention generally provide a method and apparatus for plating a metal on a substrate. The electrochemical plating system generally includes a plating cell (101) having an anolyte compartment (108) and a catholyte compartment (110), the anolyte compartment having an insoluble anode (122) and an anolyte therein. The catholyte compartment generally includes a substrate support member (124) and a catholyte therein. In addition, the plating cell generally includes an ion-exchange membrane (112) disposed between the anolyte compartment and the catholyte compartment and a pump (104) in fluid communication with the anolyte compartment, the pump configured to provide an anolyte to the anolyte compartment having a linear velocity of between about 0.5 cm/sec to about 50 cm/sec. The method generally includes supplying an anolyte solution to an anolyte compartment disposed in a plating cell having an anolyte compartment and a catholyte compartment. The anolyte solution generally passes through the anolyte compartment at a linear velocity of between about 0.5 cm/sec to about 50 cm/sec. The method further includes plating a metal onto the substrate with a catholyte solution disposed in a catholyte compartment of the plating cell, the catholyte compartment and the anolyte compartment separated by an ion-exchange membrane, removing used anolyte solution from the plating cell and passing at least a portion of the used anolyte solution through a correction device including at least one of copper oxide, copper hydroxide and combinations thereof.