发明名称 Electric device, its manufacturing method, and electronic equipment
摘要 A technique enabling a reduction in manufacturing cost of an electric device (for example, an organic EL display device) using a substrate requiring a barrier layer is described. A manufacturing method of the electric device of may include forming a peeling layer on a first substrate, forming a transferred layer that includes an electric element on the peeling layer, forming the barrier layer on the transferred layer, bonding a second substrate to the transferred layer formation on a surface side of the first substrate via an adhesive layer, transferring energy to the peeling layer through the first substrate to cause peeling in the peeling layer, and separation of the first substrate from the second substrate.
申请公布号 US2005054178(A1) 申请公布日期 2005.03.10
申请号 US20040936826 申请日期 2004.09.09
申请人 SEIKO EPSON CORPORATION 发明人 UTSUNOMIYA SUMIO
分类号 H05B33/10;H01L21/20;H01L21/77;H01L21/84;H01L27/12;H01L27/32;H01L51/50;H01L51/52;H01L51/56;H05B33/04;(IPC1-7):H01L21/00;H01L27/15;H01L31/12;H01L29/267;H01J63/04;H01J1/62;H01L23/02 主分类号 H05B33/10
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