SUBSTRATE FOR FABRICATING SEMICONDUCTOR PACKAGE TO PREVENT METAL LAND FROM BEING DAMAGED BY PENETRATION OF RESIN IN MOLDING PROCESS

摘要

PURPOSE: A substrate for fabricating a semiconductor package is provided to prevent a metal land from being damaged by penetration of resin in a molding process by forming a structure for avoiding the penetration of molding resin along the edge of a unit substrate. CONSTITUTION: A plurality of semiconductor package regions are formed on a unit substrate(10), composed of a matrix arrangement. A plurality of metal lands(14) are formed on the bottom surface of the unit substrate. The unit substrates are adhered to a metal frame(16) by an adhesion unit(18). A prevention unit for preventing penetration of molding resin(26) is formed at the edge of the bottom surface of the unit substrate.