发明名称 FILM WITH METAL LAYER AND FLEXIBLE PRINTED WIRING BOARD USING IT
摘要 PROBLEM TO BE SOLVED: To provide a film with a metal layer constituted by strongly bonding a heat-resistant resin film and a metal foil without damaging the physical properties of the heat-resistant resin film, and a flexible printed wiring board using it. SOLUTION: The film with the metal layer is constituted by forming an adhesive layer (B) and a metal layer (C) at least on one side of the heat-resistant resin film (A). The adhesive layer (B) contains a polyimide resin having a diamine component and a tetracarboxylic acid component and the amino equivalent of the polyimide resin is 2,000-60,000 g/mol. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005052981(A) 申请公布日期 2005.03.03
申请号 JP20030205653 申请日期 2003.08.04
申请人 TORAY IND INC 发明人 KASUMI KENICHI;WATANABE TAKUO;MATSUMURA NOBUO
分类号 B32B15/088;B32B15/08;C09J179/08;C09J183/04;H05K1/03;H05K3/00;(IPC1-7):B32B15/08 主分类号 B32B15/088
代理机构 代理人
主权项
地址