| 摘要 |
PROBLEM TO BE SOLVED: To adjust uniformly the gaps between a hot platen and a wafer, in order to suppress the variations of the inter-wafer and intra-wafer dimensions exhibited by a warped-off resist. SOLUTION: A semiconductor processor has gap sensors 8 for measuring the gaps between a hot platen 20 and a wafer W, and also, has driving portions which can change arbitrarily in the radial direction of the hot platen the positions of respective gap spacers for supporting a substrate and respective guiding members. Further, when judging on the basis of the operating results of the data measured by the gap sensors that the wafer goes over the guiding members, the guiding members are so moved respectively in the radial direction of the hot platen as to adjust the wafer to a predetermined position. COPYRIGHT: (C)2005,JPO&NCIPI
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