| 摘要 |
PROBLEM TO BE SOLVED: To improve aging properties of a semiconductor component. SOLUTION: A grid 17 is interposed between a plasma and a substrate 15 when a passivation layer is formed on the substrate 15 by exposing the substrate 15 in a vacuum to a flow of particles which were generated by plasmaenhanced chemical vapor deposition, thereby reducing the flow of charged particles towards the substrate 15 while conserving the flow of neutral particles. The grid 17 is also used at least at the beginning of deposition, and is formed of metal wires that are crossed at a pitch that is less than two or three times the Debye length (λD) of the plasma used. The aging properties of semiconductor components are thereby improved. COPYRIGHT: (C)2005,JPO&NCIPI
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