Semiconductor housing arrangement e.g. for semiconductor or LED, includes outer frame device formed from opaque material and positioned on substrate

摘要

A housing arrangement has a substrate (10), a semiconductor arranged on the front face or rear face of the substrate (10), a external frame device (17) which is formed from a light-opaque material and is positioned on the substrate (10) so that it surrounds the semiconductor, and an opaque polymer filler material (16) for filling the external frame device interior.