| 摘要 |
PROBLEM TO BE SOLVED: To prevent a spread of a processed result by a variation of a transportation time, a wait time and a processing time, in a process of manufacturing a semiconductor device; and to enhance a product manufacturing yield. SOLUTION: The structure is made of a coating/developing device (first/third processor) 11, an exposing device (second processor) 12, and a transporting device 13. A period from the time when a resist coated wafer is transported from the coating/developing device 11 to the exposing device 12 to the time when an exposed wafer is transported from the exposing device 12 to the coating/developing device 11 is measured, and when its measured time is a set value or more, an alarm is generated. As abnormality, a resist is separated and the reproduction process of the wafer for a resist coating, an exposure and a development is carried out again. An elapsed time from a coating of a chemical amplification resist to the development is managed, thereby preventing a variation of a resist dimension and enhancing a product manufacturing yield. COPYRIGHT: (C)2005,JPO&NCIPI |
