| 摘要 |
PROBLEM TO BE SOLVED: To provide an apparatus for sucking conductive balls onto an arranging board efficiently and accurately. SOLUTION: The apparatus for mounting conductive balls on the electrodes of a plurality of electronic components formed on a substrate by means of a suction tool comprises a mounting section for positioning the substrate on which a plurality of electrodes are formed, a conductive ball supply section containing a plurality of conductive balls, chargers for charging the conductive balls, and an arranging plate connected with a vacuum source, having a suction surface provided with a plurality of suction holes arranged similarly to a plurality of connection terminals formed on the substrate, sucking the conductive balls to the suction holes from the conductive ball supply section and mounting the conductive balls on the connection terminals of the substrate positioned at the mounting section. COPYRIGHT: (C)2005,JPO&NCIPI
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