Method of manufacturing multi-level contacts by sizing of contact sizes in integrated circuits

摘要

A method [600] for forming an integrated circuit includes etching a first opening [228] [338] [402] to a first depth in a dielectric material [322] over a semiconductor device [317] on a first semiconductor substrate [202] and etching a second opening [230] [340] [404] to a second depth in the dielectric material [322] over the first semiconductor substrate [202]. The first and second openings [228] [338] [402] [230] [340] [404] are differently sized to respectively etch to the first and second depths in about the same time due to etch lag. The first and second openings [228] [338] [402] [230] [340] [404] are filled with conductive material.