发明名称 |
Method and apparatus for detecting wafer flaw |
摘要 |
The present invention provides an apparatus for detecting flaws in a wafer. The apparatus has a detection platform for holding a wafer positioned thereon, a cross-bar ultrasonic detection device positioned above the detection platform for emitting and receiving an ultrasonic wave reflected by a wafer; and a microprocessor for processing the reflected ultrasonic and transmits to a monitor.
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申请公布号 |
US2005028594(A1) |
申请公布日期 |
2005.02.10 |
申请号 |
US20030633414 |
申请日期 |
2003.08.04 |
申请人 |
CHEN CHIH-KUN;KUNG YAO-HSIUNG;LO TUN YUAN |
发明人 |
CHEN CHIH-KUN;KUNG YAO-HSIUNG;LO TUN YUAN |
分类号 |
G01N29/07;G01N29/22;G01N29/44;(IPC1-7):G01N29/04 |
主分类号 |
G01N29/07 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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