| 摘要 |
PROBLEM TO BE SOLVED: To provide an adhesive film for semiconductor which can bond at a lower temperature a semiconductor element and a supporting member for mounting the semiconductor element of a lead frame or the like, a semiconductor device using the same film, and also to provide a dicing film having the function of the adhesive film for semiconductor material. SOLUTION: The adhesive film for semiconductor is formed of a resin substance including a plastic resin and thermosetting resin. The film is characterized in that melting viscosity is initially reduced when the adhesive film for semiconductor is heated from a normal temperature up to a melting condition in an increasing rate of 10°C/min. After the temperature has reached that for the lowest melting viscosity, the temperature further rises and the lowest melting viscosity is 2,000[Pa s] or less. The dicing film is formed by laminating an adhesive film for semiconductor and a supporting base material. The semiconductor device uses the adhesive film for semiconductor to bond the semiconductor element and the supporting member to mount the semiconductor element. COPYRIGHT: (C)2005,JPO&NCIPI
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