| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a laser beam machining method for forming a via hole on the layer to be machined formed on a metallic layer by which the remaining of a residual material inside the via hole is prevented. <P>SOLUTION: A resin layer 12 is irradiated with a pulse layer beam under the condition where the energy density per pulse in the irradiation face reaches a first value to form a via hole to a stage on the way. The inside face of the via hole 13 formed to the stage on the way is irradiated with a pulse layer beam under the condition where the energy density per pulse in the irradiation face reaches a second value higher than the first value. Thus, the sidewalls of the via hole 13 formed to the stage on the way are shaped, and simultaneously, a residual material remaining inside the via hole 13 formed to the stage on the way is removed. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
