| 摘要 |
PROBLEM TO BE SOLVED: To provide a packing box for packaging a semiconductor embossed carrier tape which is high in absorption effect and shock-absorbing effect against drop and shocks, low in material cost and working cost, and less in packing man-hour. SOLUTION: In the packing box 1 for packaging the semiconductor embossed carrier tape, all four side wall parts 3 erected from a square bottom wall part 2 have a cylindrical shock-absorbing structural part having a space therein, or have a shape of a notched center part on the surface in the same direction as the bottom wall part 2 and an upper lid part 4 in this shock-absorbing structural part. Each side wall part 3 is formed of a double or more firm structure, and excellent in absorption effect and shock-absorbing effect against the drop or shocks during the transport. COPYRIGHT: (C)2005,JPO&NCIPI
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