| 摘要 |
PROBLEM TO BE SOLVED: To provide a device for molding semiconductor leads which requires no variety of metallic mold and can readily cope with dimensions or changes of bent forms of semiconductor leads with a single device; and to provide a method for using the same. SOLUTION: The method for molding leads for semiconductor device is provided in which a group of lead forming punches is arranged at each of both upper and lower sides of a plurality of leads so that the groups of punches provide a plurality of pairs of punches, each pair facing with each other, and in which an actuator is operated to allow the punches to individually approach to or move back from each of the leads. The method comprises a step of fixing and supporting a semiconductor package at a predetermined position in the lead molding device, a step of effecting preliminary bending at least once for allowing the individual punches to form the leads so as to have a preliminary bent shape by controlling the actuator, and a step of effecting final formation for allowing the individual punches to form the leads so as to have a final shape by further controlling the actuator. COPYRIGHT: (C)2005,JPO&NCIPI
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