METHOD AND DEVICE FOR MANUFACTURING SHEET WITH IC TAG

摘要

PROBLEM TO BE SOLVED: To stick a large number of IC chips on a base material sheet body composed of packaging materials or the like while positioning them apart at prescribed intervals.

SOLUTION: The base material sheet body 10 having a base material sheet 11 is prepared. The base material sheet body 10 is inserted between a plate cylinder 30 and an impression cylinder 31. An IC chip supply liquid 23 composed of the IC chip 20 and a supply liquid 22 is supplied to the upper part of the plate cylinder 30. The IC chip 20 is filled in the recessed part 31 of the plate cylinder 30. The IC chip 20 in the recessed part 31 is transferred to the base material sheet body 10 side by pressurizing the base material sheet body 10 between the plate cylinder 30 and the impression cylinder 31.

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