发明名称 |
Method of fabricating a COF utilizing a tapered IC chip and chip mounting hole |
摘要 |
A method of manufacturing a COF package comprises the steps of providing a resin film substrate with a hole for receiving a chip, providing an IC chip having electrodes, inserting the IC chip into the hole so as to fix it with its electrodes exposed above the substrate surface, and forming a circuit pattern on the substrate surface for connection with the electrodes. The hole and the IC chip are tapered, and the IC chip is secured in the hole with sealant or adhesive.
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申请公布号 |
US6841419(B2) |
申请公布日期 |
2005.01.11 |
申请号 |
US20020240673 |
申请日期 |
2002.10.03 |
申请人 |
TORAY ENGINEERING COMPANY, LIMITED |
发明人 |
AKITA MASANORI;MORI TOSHIHIRO;ITO KOJI |
分类号 |
G06K19/077;H01L29/06;(IPC1-7):H01L21/48 |
主分类号 |
G06K19/077 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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