SEMICONDUCTOR DEVICE ABSORBING BLOCK FOR SOLDER BALL BONDING APPARATUS TO CLOSELY FIX RESIN ENCAPSULATION PART TO ABSORPTION SURFACE

摘要

PURPOSE: A semiconductor device absorbing block for a solder ball bonding apparatus is provided to closely fix a resin encapsulation part to an absorption surface by unfolding a warped semiconductor device. CONSTITUTION: A plurality of vacuum absorption holes for absorbing a resin encapsulation part of a semiconductor device are formed in the absorption surface(31) of a block body(32). An absorption part(36) vacuum-absorbs the resin encapsulation part of the semiconductor device transferred to the absorption surface, installed in the at least one vacuum absorption hole. An elastic absorption pad is installed in the vacuum absorption hole. A vacuum supply pipe supplies vacuum to the elastic absorption pad, connected to the lower part of the elastic absorption pad. A transfer unit vertically transfers the elastic absorption pad with respect to the absorption surface, installed under the elastic absorption pad in the vacuum absorption hole. The resin encapsulation part is mounted and absorbed to the elastic absorption pad ascended by the transfer unit by a predetermined height with respect to the absorption surface. The elastic absorption pad is descended to the absorption surface by the transfer unit to closely attach the resin encapsulation part to the absorption surface.