| 摘要 |
PURPOSE: A semiconductor device is provided to enhance adhesion force between an alignment key and an interlayer dielectric by using an L-shaped alignment key. CONSTITUTION: A first alignment key(26) is formed at a scribe line in patterning a first metal interconnection on a substrate. An interlayer dielectric(28) is formed on the entire surface of the resultant structure including the first alignment key. A second alignment key(30) is via-contacted to the first alignment key through the interlayer dielectric in patterning a second metal interconnection on the interlayer dielectric. At this time, the second alignment key has an L-shaped structure.
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