| 摘要 |
PURPOSE: A multi-layer heavy copper PCB and a method for manufacturing the same are provided to reduce the size and thickness of the PCB by printing a coil or core element on the PCB into a heavy copper foil. CONSTITUTION: A method for manufacturing a multi-layer heavy copper PCB, comprises a step of forming heavy copper foils(20,30) by attaching a copper foil on a pre-preg(10); a step of forming circuit patterns(21,31) and empty spaces(22,32) by removing copper foils from the portion of the copper foil(20) excluding the desired pattern, through a resist process performed on the copper foils along the required patterns and an etching process performed on the copper coils along the required circuit pattern; a step of sanding and etching top surfaces of the circuit patterns of thickness of 70 to 300§ such that convex-concave portions(23,33) are formed on top surfaces of the circuit patterns; and a step of coating, through a screen printing process, an insulation coating layer(40) made of an epoxy resin composition in the convex-concave portions formed at surfaces of the circuit patterns and in the empty spaces where copper foils are removed.
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