发明名称 THERMOSETTING RESIN COMPOSITION AND PREPREG AND SUBSTRATE PRODUCED BY USING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a thermosetting resin composition having excellent dielectric properties in a high-frequency band range and various material characteristics such as high adhesiveness, low cost and good processability and provide a prepreg and a substrate produced by using the composition. SOLUTION: The thermosetting resin composition contains a vinylbenzyl compound and a polyvalent oxazine compound having multiple dihydrobenzoxazine rings in the molecule. The prepreg is produced by impregnating the thermosetting resin composition in a glass cloth and the ratio of the glass component in the prepreg is 10-70 wt.%. The substrate is produced by laminating the prepreg and a metal foil. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2004346244(A) 申请公布日期 2004.12.09
申请号 JP20030146666 申请日期 2003.05.23
申请人 TDK CORP;SHOWA HIGHPOLYMER CO LTD 发明人 UCHIYAMA RYOTA;NISHIGUCHI SHOJI
分类号 C08J5/24;B32B15/08;B32B17/04;C08K5/17;C08K5/3445;C08K5/357;C08L25/18;H05K1/03;(IPC1-7):C08L25/18;C08K5/344 主分类号 C08J5/24
代理机构 代理人
主权项
地址