发明名称 |
THERMOSETTING RESIN COMPOSITION AND PREPREG AND SUBSTRATE PRODUCED BY USING THE SAME |
摘要 |
PROBLEM TO BE SOLVED: To provide a thermosetting resin composition having excellent dielectric properties in a high-frequency band range and various material characteristics such as high adhesiveness, low cost and good processability and provide a prepreg and a substrate produced by using the composition. SOLUTION: The thermosetting resin composition contains a vinylbenzyl compound and a polyvalent oxazine compound having multiple dihydrobenzoxazine rings in the molecule. The prepreg is produced by impregnating the thermosetting resin composition in a glass cloth and the ratio of the glass component in the prepreg is 10-70 wt.%. The substrate is produced by laminating the prepreg and a metal foil. COPYRIGHT: (C)2005,JPO&NCIPI
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申请公布号 |
JP2004346244(A) |
申请公布日期 |
2004.12.09 |
申请号 |
JP20030146666 |
申请日期 |
2003.05.23 |
申请人 |
TDK CORP;SHOWA HIGHPOLYMER CO LTD |
发明人 |
UCHIYAMA RYOTA;NISHIGUCHI SHOJI |
分类号 |
C08J5/24;B32B15/08;B32B17/04;C08K5/17;C08K5/3445;C08K5/357;C08L25/18;H05K1/03;(IPC1-7):C08L25/18;C08K5/344 |
主分类号 |
C08J5/24 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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