| 摘要 |
PROBLEM TO BE SOLVED: To increase the reliability of a semiconductor device by preventing a failure due to shortage between leads which is to be caused by a metal which deposits on a tape for fixing the leads, in a resin molded semiconductor device wherein a semiconductor chip is mounted on a lead frame and resin molding is performed. SOLUTION: The tape 2 for fixing is so stuck to a lead 11 that a side edge 11e of the lead 11 and a side edge 2e of the tape for fixing intersect perpendicularly substantially. A line of electric force generated between the leads 11 having potential difference is made to enter perpendicularly the side edge of the other lead 11 from the side edge of one lead 11, and generation of a part in which lines of electric force are concentrated is prevented. As a result, distribution of attainment portions of Cu ions eluted from the lead 11 in the facing lead 11 is equalized, and thereby, the growth of dendrite is restrained. COPYRIGHT: (C)2005,JPO&NCIPI |
