| 摘要 |
PROBLEM TO BE SOLVED: To provide an COB (chip on board) type electronic circuit device which can control the coating surface area of sealing resin to be constant while eliminating the need for adding an element for controlling the flow of the sealing resin to essentially necessary elements, with a low cost, a small size, and a high reliability. SOLUTION: The electronic circuit device comprises a substrate 1 having an internal terminal 9 and a wiring 2 formed to the internal terminal, an electronic component 10 mounted on the substrate to be connected to the internal terminal, and a sealing resin 12 for sealing the electronic component and the internal terminal. The wiring partially forms a ring-shaped part 3, the ring-shaped part has a plurality of gaps 15 and 16, by which the ring-shaped part is divided into a plurality of discontinuous annular pieces 4a, 4b, 5a, 5b. The plurality of annular pieces are connected to the internal terminal, and a region coated with the sealing resin is surrounded by the ring-shaped part. COPYRIGHT: (C)2005,JPO&NCIPI
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