| 发明名称 |
Method for packaging chips, involves embedding mixture of metal particles into chip with high pressure, where mixture of metal particles are pre-processed and compressed by using oven |
| 摘要 |
<p>The method involves embedding mixture of metal particles into chips with high pressure. The mixture of metal particles are pre-processed and compressed by using an oven.</p> |
| 申请公布号 |
ES2219150(A1) |
申请公布日期 |
2004.11.16 |
| 申请号 |
ES20020001427 |
申请日期 |
2002.06.21 |
| 申请人 |
MARINO BERRIO S.L. |
发明人 |
BERRIO BUENO EZEQUIEL |
| 分类号 |
B30B9/32;(IPC1-7):B30B9/32 |
主分类号 |
B30B9/32 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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