| 摘要 |
Electrically conductive, thermoset molding compositions are disclosed which comprise an unsaturated thermosetting resin, an olefinically unsaturated monomer which is copolymerizable with the thermosetting resin, a thermoplastic additive and carbon black. The carbon black is incorporated in a conductive additive which comprises the thermoplastic additive, the carbon black and, preferably, a lubricant. The electrical resistance of articles molded from the disclosed molding compositions is typically less than about 10<8 >ohms/cm<2>.
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