| 摘要 |
PROBLEM TO BE SOLVED: To improve durability against a temperature cycle and to improve heat radiating properties. SOLUTION: A substrate 1 for a power module includes a metal layer 3 laminated on one surface of an insulating board 2, a heat sink 6 connected to the other surface of the insulating board 2, and a semiconductor chip 5 carried on the metal layer 3. In this substrate 1 for the power module, the heat sink 6 is constituted of Cu of 6 nines or higher (copper of purity of 99.9999% or more). Even when the substrate 1 is used under the condition of repeated operation of the temperature cycle, an internal stress is not stored, but work hardening at the side of the high temperature of the temperature cycle can be suppressed. Accordingly, releasing between the insulating board 2 and the heat sink 6, and the damage of the insulating board 2, can be prevented. Further, durability against the temperature cycle can be remarkably raised. COPYRIGHT: (C)2005,JPO&NCIPI
|
