Semiconductor wafer treatment by brushing before bonding

摘要

Gluing of two platelets at the level of two gluing surfaces respectively comprises: (a) activation of at least one gluing surface; (b) putting the gluing surfaces into contact. The activation stage is obtained by brushing the gluing surface. An independent claim is also included for the removal of a layer of semiconducting material from a donor platelet which incorporates a stage using this method of gluing two platelets together.