MANUFACTURING METHOD OF SUBSTRATE

摘要

PROBLEM TO BE SOLVED: To provide a manufacturing method of a substrate by which a metallic conductive layer is formed selectively on a hole inner wall with a simple constitution. SOLUTION: The manufacturing method for a substrate contains at least a process in which thermoplastic resin layers 4 are formed on both surfaces of the substrate for forming a circuit by using the substrate 10 for forming the circuit to which a hole 3 is formed, a process in which the resin layers in the opening section of the hole are removed and the thermoplastic resin layers are formed on both surfaces of the substrate with the exception of the opening section, a process in which the metallic conductive layers 2 are formed on the inner walls of the through-hole by a plating treatment, and a process in which the resin layers are removed. COPYRIGHT: (C)2005,JPO&NCIPI