| 摘要 |
PROBLEM TO BE SOLVED: To prevent synthetic resin sheet thermal deformation so that the deformation will not increase the overall thickness of the device when a different board is soldered to the surface of a circuit board with a synthetic resin sheet arranged on the other surface of the circuit board. SOLUTION: In a process wherein a different board 30 is soldered to the surface of a circuit board 30 with a synthetic resin sheet 42 arranged on the other side of the circuit board 30, a heat-resistant tape 36 is provided to surround a heated region surface 35 on the side opposite to the soldered region 31 of the circuit board 30. Due to the thickness of the heat-resistant tape 36, the thin layer G of air is created between the heated region surface 35 and the synthetic resin sheet 42. COPYRIGHT: (C)2005,JPO&NCIPI
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