| 摘要 |
PROBLEM TO BE SOLVED: To provide an inexpensive manufacturing method wherein pin lamination jigs and tools for aligning are not employed in a lamination pressing process. SOLUTION: The multilayer flexible printed circuit board is manufactured by a method wherein a plurality of flexible circuit substrates and a plurality of flexible copper clad plates are superposed through an interlayer adhesive sheet and laminated integrally by heating and pressurizing. The manufacturing method comprises a process for positioning and superposing the flexible circuit substrate and the flexible copper clad plate through the interlayer adhesive sheet, a process for applying heating and pressurizing treatment on the superposed substrate to bond preliminarily while keeping the interlayer adhesive sheet under the state of B-stage, and a process for effecting laminating press integrally by heating and pressurizing without employing pins for positioning. COPYRIGHT: (C)2005,JPO&NCIPI |
