发明名称 Semiconductor optical package
摘要 A semiconductor optical package having a TO-can structure including a housing and a stem accommodated in the housing is disclosed. The semiconductor optical package includes a sub-mount mounted on the stem, and a reflective semiconductor optical amplifier having first and second ends, through which light is input and output The optical amplifier also includes an active layer extending by a predetermined length while being inclined at a predetermined angle with respect to an axis perpendicular to the first and second ends. The reflective semiconductor optical amplifier amplifies light input through the first end and rests on the sub-mount in such a manner that an axis of light, which is input or output through the first and second ends, respectively, is perpendicular to both ends of the sub-mount.
申请公布号 US2004202213(A1) 申请公布日期 2004.10.14
申请号 US20040839304 申请日期 2004.05.05
申请人 YUN IN-KUK;LEE JEONG-SEOK;KIM HO-IN;SHIN HYUN-CHEOL;HWANG SEONG-TAEK 发明人 YUN IN-KUK;LEE JEONG-SEOK;KIM HO-IN;SHIN HYUN-CHEOL;HWANG SEONG-TAEK
分类号 H01S5/22;H01L31/14;H01S3/04;H01S3/08;H01S5/02;H01S5/022;H01S5/028;H01S5/0683;(IPC1-7):H01S3/04 主分类号 H01S5/22
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