| 摘要 |
PURPOSE: An apparatus and a method for fabricating a bonded substrate are provided to avoid side slip of the substrate by means of repulsive force of process pressure generated when bonding two substrates together. CONSTITUTION: In an apparatus for fabricating a bonded substrate, a first substrate and a second substrate are adsorbed into a first retention plate(61) and a second retention plate(62) arranged to face each other in a chamber, by using either pressure difference adsorption or electrostatic adsorption, and are bonded together by approaching them to each other. Either the first retention plate or the second retention plate is provided with a frictional resistor that retains the first and second substrates by frictional resistance, thereby failing to cause an error in the position between the substrates when bonding them to each other.
|
